KOR

  ¤Ó  

ENG

  ¤Ó  

CHN

¼±

SAMSUNG
MLCC

HOME > Samsung MLCC > Samsung MLCC Product

PCB

Package Substrate

Mobile Device¿Í PCÀÇ ÇÙ½É ¹ÝµµÃ¼¿¡ »ç¿ëµÇ´Â Package ±âÆÇÀ¸·Î, ¹ÝµµÃ¼¿Í ¸ÞÀκ¸µå°£ Àü±âÀû ½ÅÈ£ Àü´Þ¿ªÇÒÀ» ÇÕ´Ï´Ù. ÀÏ¹Ý ±âÆÇ º¸´Ù ÈξÀ ´õ ¹Ì¼¼ÇÑ È¸·Î°¡ Çü¼ºµÇ¾î ÀÖ´Â °í¹Ðµµ ȸ·Î ±âÆÇÀ¸·Î, °í°¡ÀÇ ¹ÝµµÃ¼¸¦ Á÷Á¢ ¸ÞÀÎ ±âÆÇ¿¡ ºÎÂøÇÏ°Ô µÉ ¶§ ¹ß»ýÇÏ´Â Á¶¸³ºÒ·®°ú ºñ¿ëÀ» ÁÙÀÏ ¼ö ÀÖ½À´Ï´Ù.

CATALOG DOWNLOAD

  • FCCSP(Flip Chip Chip Scale Package)

    ¹ÝµµÃ¼ ChipÀÇ Å©±â°¡ ¿Ï¼ºµÈ ºÎÇ°¸éÀûÀÇ 80%°¡ ³Ñ´Â Á¦Ç°À» ¸»Çϸç Flip Chip Bump¸¦ »ç¿ëÇϱ⠶§¹®¿¡ FCCSP(Flip Chip Chip Scale Package)¶ó°í ºÎ¸¨´Ï´Ù.

    Line UP